Jingook Kim: search on Z-Library

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1

[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - An On-die Oscilloscope for System-Level ESD Noise Monitoring

Lee, Wooryong, Park, Junsik, Kim, Jingook, Ryu, Chunghyun, Lee, Jongsung, Kang, Bonggyu, Bae, Bumhee

Year:

2019

Language:

english

File:

PDF, 523 KB

english, 2019

2

IC Failure Analysis Due to Charged Board Events by Measurements and Modeling of Discharging Currents Through IC Pins

Park, Junsik, Lee, Jongsung, Jo, Cheolgu, Seol, Byongsu, Kim, Jingook

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2017

Language:

english

File:

PDF, 2.78 MB

english, 2017

3

Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays

Jingook Kim,, Shringarpure, K, Jun Fan,, Joungho Kim,, Drewniak, J L

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2011

Language:

english

File:

PDF, 558 KB

english, 2011

4

Efficient Calculation of Inductive and Capacitive Coupling Due to Electrostatic Discharge (ESD) Using PEEC Method

Park, Junsik, Lee, Jongsung, Seol, Byongsu, Kim, Jingook

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2015

Language:

english

File:

PDF, 1.48 MB

english, 2015

5

Microwave frequency interconnection line model of a wafer level package

Junwoo Lee,, Woonghwan Ryu,, Jingook Kim,, Junho Lee,, Namhoon Kim,, Junso Pak,, Jae-Myun Kim,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2002

Language:

english

File:

PDF, 523 KB

english, 2002

6

Improved Target Impedance for Power Distribution Network Design With Power Traces Based on Rigorous Transient Analysis in a Handheld Device

Jingook Kim,, Takita, Yuzo, Araki, Kenji, Jun Fan,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.04 MB

english, 2013

7

[IEEE 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - Santa Clara, CA, USA (2015.3.15-2015.3.21)] 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity - On-chip linear voltage regulator module (VRM) effect on power distribution network (PDN) noise and jitter at high-speed output buffer

Kim, Heegon, Kim, Sukjin, Kim, Joungho, Yoon, Changwook, Kim, Jingook, Achkir, Brice, Fan, Jun

Year:

2015

Language:

english

File:

PDF, 803 KB

english, 2015

8

Fast and Accurate Calculation of System-Level ESD Noise Coupling to a Signal Trace by PEEC Model Decomposition

Park, Junsik, Lee, Jongsung, Seol, Byongsu, Kim, Jingook

Journal:

IEEE Transactions on Microwave Theory and Techniques

Year:

2017

Language:

english

File:

PDF, 2.61 MB

english, 2017

9

[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Design of effective surge protection circuits for an active EMI filter

Jeong, Sangyeong, Shin, Dongil, Kim, Jingook, Kim, Jongpil, Kim, Seokjoon

Year:

2017

Language:

english

File:

PDF, 654 KB

english, 2017

10

Quantified Design Guidelines of a Compact Transformerless Active EMI Filter for Performance, Stability, and High Voltage Immunity

Shin, Dongil, Jeong, Sangyeong, Kim, Jingook

Journal:

IEEE Transactions on Power Electronics

Year:

2018

Language:

english

File:

PDF, 1.82 MB

english, 2018

11

[IEEE Electrical Performance of Electronic Packaging - Princeton, NJ, USA (2003.10.27-2003.10.29)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Youchul Jeong,, Hyungsoo Kim,, Jingook Kim,, Jongbae Park,, Joungho Kim,

Year:

2003

Language:

english

File:

PDF, 256 KB

english, 2003

12

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - A common-mode active filter in a compact package for a switching mode power supply

Shin, Dongil, Han, Ki Jin, Kim, Jingook, Kim, Sungnam, Jeong, Geunseok, Park, Jaesu, Park, Joungwook

Year:

2014

Language:

english

File:

PDF, 1.55 MB

english, 2014

13

Analysis and Design Guide of Active EMI Filter in a Compact Package for Reduction of Common-Mode Conducted Emissions

Shin, Dongil, Kim, Sungnam, Jeong, Geunseok, Park, Jaesu, Park, Joungwook, Han, Ki Jin, Kim, Jingook

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2015

Language:

english

File:

PDF, 1.09 MB

english, 2015

14

[IEEE 2002 International Symposium on Electromagnetic Compatibility - Minneapolis, MN, USA (19-23 Aug. 2002)] IEEE International Symposium on Electromagnetic Compatibility - Radiated emission from plasma display panel (PDP) depending on addressing line structure and current driving scheme

Youchul Jeong,, Junwoo Lee,, Jingook Kim,, Suna Choi,, Joungho Kim,, Hyun Ho Park,, Kyungho Kang,, Heehwan Kim,, Kiwoong Whang,

Year:

2002

Language:

english

File:

PDF, 265 KB

english, 2002

15

Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

Jingook Kim, Rotaru, M.D., Seungyong Baek, Jongbae Park, Iyer, M.K., Joungho Kim

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2006

Language:

english

File:

PDF, 1.49 MB

english, 2006

16

Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions

Jun Fan, Xiaoning Ye, Jingook Kim, Archambeault, B., Orlandi, A.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2010

Language:

english

File:

PDF, 239 KB

english, 2010

17

A Transformer-Isolated Common-Mode Active EMI Filter without Additional Components on Power Lines

Jeong, Sangyeong, Shin, Dongil, Kim, Jingook

Journal:

IEEE Transactions on Power Electronics

Year:

2018

Language:

english

File:

PDF, 2.07 MB

english, 2018

18

[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - Improvement of Surge Immunity by Using Transformer-isolation in an Active EMI Filter

Jeong, Sangyeong, Kim, Jingook

Year:

2019

Language:

english

File:

PDF, 551 KB

english, 2019

19

Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards

Jingook Kim,, Heeseok Lee,, Joungho Kim,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 632 KB

english, 2005

20

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Improved target impedance and IC transient current measurement for power distribution network design

Jingook Kim,, Songping Wu,, Hanfeng Wang,, Takita, Yuzou, Takeuchi, Hayato, Araki, Kenji, Gang Feng,, Jun Fan,

Year:

2010

Language:

english

File:

PDF, 408 KB

english, 2010

21

[IEEE 2016 IEEE Energy Conversion Congress and Exposition (ECCE) - Milwaukee, WI, USA (2016.9.18-2016.9.22)] 2016 IEEE Energy Conversion Congress and Exposition (ECCE) - A simple low-cost common mode active EMI filter using a push-pull amplifier

Shin, Dongil, Kim, Jingook, Son, Changwoo, Jeon, Seonho, Cho, Bongjin, Han, Jinwook

Year:

2016

Language:

english

File:

PDF, 749 KB

english, 2016

22

Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance

Wang, Hanfeng, Pan, Siming, Kim, Jingook, Ruehli, Albert E., Fan, Jun

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

23

Closed-Form Expressions for the Noise Voltage Caused by a Burst Train of IC Switching Currents on a Power Distribution Network

Kim, Jingook, Lee, Jongjoo, Ahn, Seungyoung, Fan, Jun

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2014

Language:

english

File:

PDF, 1.50 MB

english, 2014

24

[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - System-level ESD noise induced by secondary discharges at voltage suppressor devices in a mobile product

Park, Junsik, Kim, Jingook, Lee, Jongsung, Jo, Cheolgu, Seol, Byongsu

Year:

2017

Language:

english

File:

PDF, 893 KB

english, 2017

25

[IEEE IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA (21-23 Oct. 2002)] Electrical Performance of Electronic Packaging, - Analysis of via distribution effect on multi-layered power/ground transfer impedance of high-performance packages

Hyungsoo Kim,, Jingook Kim,, Youchul Jeong,, Jongbae Park,, Joungho Kim,

Year:

2002

Language:

english

File:

PDF, 338 KB

english, 2002

26

[IEEE 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011 - Long Beach, CA, USA (2011.08.14-2011.08.19)] 2011 IEEE International Symposium on Electromagnetic Compatibility - Analytical expressions for transfer function of supply voltage fluctuation to jitter at a single-ended buffer

Kim, Jingook, De, Soumya, Shringarpure, Ketan, Pan, Siming, Achkir, Brice, Fan, Jun, Drewniak, James L.

Year:

2011

Language:

english

File:

PDF, 662 KB

english, 2011

27

Closed-Form Expressions for the Maximum Transient Noise Voltage Caused by an IC Switching Current on a Power Distribution Network

Jingook Kim,, Liang Li,, Songping Wu,, Hanfeng Wang,, Takita, Y., Takeuchi, H., Araki, K., Fan, J., Drewniak, J. L.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2012

Language:

english

File:

PDF, 1.22 MB

english, 2012

28

[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Compensation of undesired channel effects by frequency domain optimization of pre-emphasis filter for over Gbps signaling

Jingook Kim,, Jiwang Lee,, Eakhwan Song,, Jeonghyeon Jo,, Joungho Kim,

Year:

2006

Language:

english

File:

PDF, 433 KB

english, 2006

29

[IEEE 2015 IEEE International Symposium on Electromagnetic Compatibility - EMC 2015 - Dresden, Germany (2015.8.16-2015.8.22)] 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Calculation of power-supply-induced jitter at a 3-D IC channel including ESD protection circuits

Park, Eunkyeong, Kim, Jingook, Lee, Jongjoo, Park, Youngwoo

Year:

2015

Language:

english

File:

PDF, 1.22 MB

english, 2015

30

An Enhanced Statistical Analysis Method for I/O Links Considering Supply Voltage Fluctuations and Intersymbol Interference

Kim, Jingook, Lee, Jongjoo, Park, Eunkyeong, Park, Youngwoo

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 3.35 MB

english, 2015

31

[IEEE 2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) - Garden Grove, CA, USA (2016.9.11-2016.9.16)] 2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD) - Measurement of discharging currents through an IC due to the charged board event using a shielded Rogowski coil

Park, Junsik, Lee, Jongsung, Kim, Seongmoo, Jo, Cheolgu, Seol, Byongsu, Kim, Jingook

Year:

2016

Language:

english

File:

PDF, 743 KB

english, 2016

32

[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - Experimental Validation of an Integrated Circuit Transient Electromagnetic Event Sensor

Marathe, Shubhankar, Patnaik, Abhishek, Ghosh, Kaustav, Kim, Jingook, Pommerenke, David, Beetner, Daryl G.

Year:

2019

Language:

english

File:

PDF, 723 KB

english, 2019

33

[IEEE 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Haining (2017.12.14-2017.12.16)] 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Electromagnetic simulations of a neuromorphic hardware using PEEC and memristor SPICE models

Lee, Wooryong, Park, Junsik, Kim, Jingook

Year:

2017

Language:

english

File:

PDF, 583 KB

english, 2017

34

Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor

Jingook Kim,, Youchul Jeong,, Jaemin Kim,, Joungho Kim,

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2006

Language:

english

File:

PDF, 403 KB

english, 2006

35

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Efficient calculation of ESD inductive coupling on a conductor loop using PEEC method

Park, Junsik, Kim, Jingook, Lee, Jongsung, Seol, Byongsu

Year:

2014

Language:

english

File:

PDF, 1.14 MB

english, 2014

36

[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Extraction of equivalent array dipole-moments model from only magnitude data of near-field scan

Kwak, Kyungjin, Kim, Jingook, Bae, Tae-il, Hong, Kichul, Kim, Hyungsoo

Year:

2017

Language:

english

File:

PDF, 812 KB

english, 2017

37

[IEEE 2011 IEEE International Symposium on Electromagnetic Compatibility - EMC 2011 - Long Beach, CA, USA (2011.08.14-2011.08.19)] 2011 IEEE International Symposium on Electromagnetic Compatibility - Optimizing decoupling capacitor placement to reduce effective inductance

Archambeault, Bruce, Kim, Jingook, Connor, Sam, Fan, Jun

Year:

2011

Language:

english

File:

PDF, 1.51 MB

english, 2011

38

High-Frequency Testing of Vertical Interconnection Array Using Indirect Contact Probing Method With an Improved Calibration

Jeong, Jongwoo, Kim, Jingook, Kang, No-Weon, Han, Ki Jin

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.89 MB

english, 2016

39

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - An equivalent three-dipole model for IC radiated emissions based on TEM cell measurements

Siming Pan,, Jingook Kim,, Sungnam Kim,, Jaesu Park,, Heoncheol Oh,, Jun Fan,

Year:

2010

Language:

english

File:

PDF, 2.67 MB

english, 2010

40

Picosecond time-domain characterization of CPW bends using a photoconductive near-field mapping probe

Jongjoo Lee,, Jingook Kim,, Sungkyu Yu,, Joungho Kim,

Journal:

IEEE Microwave and Wireless Components Letters

Year:

2001

Language:

english

File:

PDF, 241 KB

english, 2001

41

[IEEE 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Beijing, China (2010.04.12-2010.04.16)] 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Analysis of mutual inductance effect between decoupling capacitors on planar power bus

Kim, Jingook, Archambeault, Bruce, Knighten, James L., Fan, Jun

Year:

2010

Language:

english

File:

PDF, 726 KB

english, 2010

42

[IEEE 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009 - Austin, TX, USA (2009.08.17-2009.08.21)] 2009 IEEE International Symposium on Electromagnetic Compatibility - Frequency-dependent via inductances for accurate power distribution network modeling

Ren, Liehui, Kim, Jingook, Feng, Gang, Archambeault, Bruce, Knighten, James L., Drewniak, James, Fan, Jun

Year:

2009

Language:

english

File:

PDF, 549 KB

english, 2009

43

[IEEE International Symposium on Electromagnetic Compatibility - Boston, MA, USA (18-22 Aug. 2003)] 2003 IEEE Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.03CH37446) - Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB

Jun So Pak,, Jingook Kim,, Jung-Gun Byun,, Heejae Lee,, Joungho Kim,

Year:

2003

Language:

english

File:

PDF, 291 KB

english, 2003

44

[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation

Jaemin Kim,, Youchul Jeong,, Jingook Kim,, Junho Lee,, Jongjoo Shim,, Joungho Kim,

Year:

2006

Language:

english

File:

PDF, 385 KB

english, 2006

45

Seismic performance of structures connected by viscoelastic dampers

Jinkoo Kim, Jingook Ryu, Lan Chung

Journal:

Engineering Structures

Year:

2006

Language:

english

File:

PDF, 4.90 MB

english, 2006

46

Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board

Shringarpure, Ketan, Pan, Siming, Kim, Jingook, Fan, Jun, Achkir, Brice, Archambeault, Bruce, Drewniak, James L.

Journal:

IEEE Transactions on Electromagnetic Compatibility

Year:

2016

Language:

english

File:

PDF, 1.34 MB

english, 2016

47

[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Investigation of the probe-factor deconvolution methods for dynamic ESD fields measurements

Park, Myungjoon, Kim, Jingook, Choi, Joungcheul, Kim, Jinwoo, Jeong, Seonghoon, Seung, Manho, Lee, Seokkiu

Year:

2017

Language:

english

File:

PDF, 1.19 MB

english, 2017

48

[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Design and analysis of improved multi-module memory bus using wilkinson power divider

Jingook Kim,, Eakhwan Song,, Jaemin Kim,, Joungho Kim,, Myunghee Sung,, Jonghoon Kim,, Byungse So,

Year:

2006

Language:

english

File:

PDF, 578 KB

english, 2006

49

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Analytical jitter estimation of two-stage output buffers with supply voltage fluctuations

Park, Eunkyeong, Kim, Jingook, Kim, Hyungsoo, Shon, Kwansu

Year:

2014

Language:

english

File:

PDF, 1.30 MB

english, 2014

50

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Design criteria of automatic fixture removal (AFR) for asymmetric fixture de-embedding

Yoon, Changwook, Tsiklauri, Mikheil, Zvonkin, Mikhail, Fan, Jun, Drewniak, James L., Razmadze, Alexander, Aflaki, Aman, Kim, Jingook, Chen, Qinghua Bill

Year:

2014

File:

PDF, 333 KB

2014

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